2mm High Heat Sinks Perfect for Cooling Tight-Spaced, Passive Cooling Applications

blueICE ultra low-profile heat sinks come in 2 to 7mm heights and are ideal for tight-space, passive cooling applications such as: – connected appliances – IIOT (Industrial Internet of Things) – autonomous farming equipment – drones. Their spread fin design … Continue reading → Source: Advanced Thermal Solutions…

Improving your thermal management might be as simple as adding a different heat sink

ATS maxiFLOW heat sinks provide the highest thermal performance for physical volume occupied compared to other heat sink designs. maxiFLOW heat sinks are ideal for cooling BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP packages. Whenever higher cooling capacity … Continue reading → Source: Advanced Thermal Solutions…

Stamped heat sinks for resistors and semiconductors in TO-3s, TO-5s, TO-218s, TO-126s, TO-127s and TO-202s packages

ATS’ high quality, low cost, aluminum stamped heat sinks are ideal for cooling TO-220s and other low power packages (e.g. TO-3s, TO-5s, TO-218s, TO-126s, TO-127s and TO-202s). They feature anodized material with solderable tabs. Stamped heat sinks are attached using … Continue reading → Source: Advanced Thermal Solutions…

fanSINK Line Expanded by ATS, Footprints Now 27mm x 84mm

Does your design need cooling for hot components not getting enough air or have components that simply need spot cooling? The ATS fanSINK line is now available in sizes from 27mm to 84mm. Engineers can now easily add industry leading … Continue reading → Source: Advanced Thermal Solutions…

Our Custom Zipper Fin Heat Sinks feature No NRE and No MOQ

If you have a project that requires: A custom heat sink Might need a copper or aluminum base Maybe includes a vapor chamber or heat pipes Then our Zipper Fin Heat Sinks would likely meet your projects need. They require … Continue reading → Source: Advanced Thermal Solutions…

Engineering How-To: Attaching Heat Pipes into an Assembly

Heat pipes are commonly used for cooling electronics by transporting heat from one location to another. They may part of a system that cools a certain very hot component, but they are used, typically in multiples, to bring cooling to … Continue reading → Source url: Source at Advanced Thermal Solutions…

Visit Advanced Thermal Solutions at Electronica India

ATS will be exhibiting at Electronica-India in our sale partner, Ismosys, booth starting Wednesday September 25th, 2019 and going through September 27th, 2019. We will be in hall 10, booth EF51: We will have a number of products in the … Continue reading → Source url: Source at Advanced Thermal Solutions…

Quantum Computing Cooling

By Norman QuesnelSenior Member of Marketing StaffAdvanced Thermal Solutions, Inc. (ATS) Applications needing much higher processing power than from today’s most powerful supercomputers will very likely have to run on quantum computers. These devices have the potential to solve complex … Continue reading → Source url: Source at Advanced Thermal Solutions…

Technology Review: Spray Cooling

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the … Continue reading → Source url: Source…

3-D-printed Heat Exchangers provide flexibility in thermal management

By Norman QuesnelSenior Member of Marketing StaffAdvanced Thermal Solutions, Inc. (ATS) Additive manufacturing technologies have expanded in many directions in recent years with applications ranging across numerous industries and applications, including into the thermal management of electronics. As metal 3-D … Continue reading → Source url: Source…